● Exceptional Thermal Conductivity: With a thermal conductivity of 8.0W/M.K, this gel facilitates superior heat transfer, essential for high-power and high-density electronic components.
● Single-component Design: Simplifies the application process, eliminating the need for mixing and reducing the potential for errors, saving time and enhancing ease of use.
● Outstanding Thermal Stability: Maintains consistent performance across a wide temperature range, ensuring reliable operation in even the most challenging environments.
● Minimal Thermal Resistance: Features ultra-low thermal resistance at interfaces, maximizing heat dissipation efficiency between components and heatsinks.
Feature | Value | Unit | Test Method |
ThermalConductivity | 8.0(±0.5) | W/m·K | ASTM D5470 |
Thermal Impedance | ≤0.15 | ℃-in2/W | ASTM D5470 |
Color | Grey | -- | Visual |
Viscosity | 85*104 | mPa.s@25℃ | Rheometer DHR-2 |
Density | 3.4(±0.5) | g/cc | ASTM D792 |
Extrusion Speed | 20 | g | g/min(50Mpa) |
30 | g | g/min(100Mpa) | |
Flammability Rating | V-0 | -- | UL 94 |
Working Temperature | -50~160 | ℃ | IEC 60068-2-14 |
Breakdown Voltage | ≥7 | Kv/mm | ASTM D149 |
Volume Resistivity | ≥1.0*1011 | Ω·cm | ASTM D257 |