8.0W/M.K  One-part Thermal Gel
8.0W/M.K  One-part Thermal Gel

8.0W/M.K One-part Thermal Gel

8.0W/M.K One-part Thermal Gel
Conductivity:8.0W/M.K
Working Temperature:-40-200℃
Certification:UL,ROHS,REACH
Conductivity:8.0W/M.K
Working Temperature:-40-200℃
Certification:UL,ROHS,REACH
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8.0W/M.K One-part Thermal Gel Apply For Quotation
Introduction
NFION 8.0W/M.K One-part Thermal Gel is a top-tier thermal interface material designed for the most demanding thermal management challenges in high-performance electronics. This gel offers exceptional heat dissipation capabilities, ensuring optimal performance, reliability, and longevity for cutting-edge devices operating under extreme conditions. It is engineered to enhance the efficiency and durability of critical components, providing unmatched value in high-tech applications.
Features

●  Exceptional Thermal Conductivity: With a thermal conductivity of 8.0W/M.K, this gel facilitates superior heat transfer, essential for high-power and high-density electronic components.

●  Single-component Design: Simplifies the application process, eliminating the need for mixing and reducing the potential for errors, saving time and enhancing ease of use.

●  Outstanding Thermal Stability: Maintains consistent performance across a wide temperature range, ensuring reliable operation in even the most challenging environments.

●  Minimal Thermal Resistance: Features ultra-low thermal resistance at interfaces, maximizing heat dissipation efficiency between components and heatsinks.

●  Non-corrosive and Safe: Safe for use in sensitive electronic environments, this gel is non-corrosive and free from toxic substances, ensuring reliability and safety.
Application method
●  Automated Dispensing: Designed for seamless integration with automated dispensing systems, ensuring precise and efficient application in high-volume production.
●  Direct Manual Application: Can be easily applied using dispensing tools or spatulas for custom or smaller-scale applications.
●  Immediate Use: Ready for immediate application without the need for curing time, facilitating quick and straightforward deployment.
●  Reworkable: Easily removable and reapplicable, allowing for adjustments without compromising thermal performance.
Application
● ​High-Performance Computing: Ideal for cooling CPUs, GPUs, and other high-performance computing components in data centers and high-performance computing environments.
● ​Telecommunications Infrastructure: Perfect for base stations, routers, and other telecommunications equipment requiring superior thermal management.
● ​Electric Vehicles: Essential for powertrain systems, battery management, and other automotive electronics demanding exceptional heat dissipation.
● ​Industrial Equipment: Suitable for power supplies, motor drives, and other industrial applications where effective thermal management is crucial for operational efficiency and safety.
● ​LED Lighting Systems: Ensures optimal heat dissipation in high-intensity LED applications, enhancing performance and extending the lifespan of LED modules.
Specification
Feature             Value Unit Test Method
ThermalConductivity 8.0(±0.5) W/m·K ASTM D5470
Thermal   Impedance ≤0.15 -in2/W ASTM D5470
Color           Grey -- Visual
Viscosity            85*104 mPa.s@25 Rheometer DHR-2
Density            3.4(±0.5) g/cc ASTM D792
Extrusion Speed   20 g g/min(50Mpa)
30 g g/min(100Mpa)
Flammability Rating V-0 -- UL 94
Working Temperature -50~160 IEC 60068-2-14
Breakdown Voltage ≥7 Kv/mm ASTM D149
Volume   Resistivity ≥1.0*1011 Ω·cm ASTM D257
SpecificationsBrochure
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8.0W/M.K  One-part Thermal Conductive Gel Email:info@nfion.com