5.0W/M.K One-part Thermal Gel
5.0W/M.K One-part Thermal Gel

5.0W/M.K One-part Thermal Gel

5.0W/M.K One-part Thermal Gel
Conductivity:5.0W/M.K
Working Temperature:-40-200℃
Certification:UL,ROHS,REACH
Conductivity:5.0W/M.K
Working Temperature:-40-200℃
Certification:UL,ROHS,REACH
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5.0W/M.K One-part Thermal Gel Apply For Quotation
Introduction
NFION 5.0W/M.K One-part Thermal Gel is an advanced thermal interface material designed for cutting-edge electronic applications. It offers unmatched heat dissipation capabilities, addressing critical thermal management challenges in high-power devices. This gel ensures optimal performance, reliability, and longevity, providing significant value by enhancing device efficiency and preventing overheating issues.

Features

●  Exceptional Thermal Conductivity: With a thermal conductivity of 5.0W/M.K, this gel facilitates rapid and efficient heat transfer, crucial for high-power electronic components.

●  Single-component Design: Simplifies application with no mixing required, reducing application time and potential errors.

●  High Thermal Stability: Maintains excellent performance across a wide temperature range, ensuring reliability in diverse operating conditions.

●  Low Thermal Resistance: Minimizes thermal resistance at interfaces, maximizing heat dissipation efficiency between components and heatsinks.

●  Safe and Non-toxic: Non-corrosive and safe for sensitive electronic applications, ensuring reliability without health risks.

Application method

●  Precision Automated Dispensing: Compatible with automated dispensing systems for accurate and efficient application in high-volume production.

●  Direct Application: Can be applied manually using dispensing tools or spatulas for smaller scale or custom applications.

●  Immediate Use: Ready for immediate use after application, eliminating the need for curing time.

●  Reworkable: Easily removable and reapplicable without compromising performance, facilitating adjustments as needed.
Application
● Data Centers and Servers: Ideal for cooling CPUs, GPUs, and other high-performance computing components.
● Telecommunication Equipment: Suitable for base stations, routers, and servers requiring efficient thermal management.
● Automotive Electronics: Perfect for electric vehicle powertrains, battery management systems, and other automotive electronics demanding superior heat dissipation.
● Industrial Equipment: Applicable in power supplies, motor drives, and other industrial devices where thermal management is critical.
● LED Lighting: Ensures effective heat dissipation in high-intensity LED applications, enhancing performance and lifespan.
Specification
Testing Item Unit Testing Value Testing Method
Component - Silicone&Thermal Powder -
Colour -

Gray or Customized

Visual
Density G/CC 3.4(±0.5) ASTM D 792
Viscosity ( mPa.s@25) 85*104 Rheometer DHR-2
Thermal Resistance ℃*IN2/W 0.09 ASTM D5470
Extrusion Flow Rate G/MIN 20 g/min(50MPa)
G/MIN 30 g/min(100MPa)
Weight Loss % 0.5 @200℃240H
Voltage Resistivity Ω·CM >1*1013 ASTM D257
Working Temperature -40~200 IEC 60068-2-14
Mini interface Thickness MM 0.09 -
Flammability - V-0 UL 94
Thermal Conductivity W/M.K 5.0  ASTM D5470
SpecificationsBrochure
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5.0W/M.K One-part Thermal Gel Email:info@nfion.com