1.5W/M.K One-part Thermal Gel
1.5W/M.K One-part Thermal Gel

1.5W/M.K One-part Thermal Gel

1.5W/M.K One-part Thermal Gel
Conductivity:1.5W/M.K
Working Temperature:-40-200℃
Certification:UL,ROHS,REACH
Conductivity:1.5W/M.K
Working Temperature:-40-200℃
Certification:UL,ROHS,REACH
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1.5W/M.K One-part Thermal Gel Apply For Quotation
Introduction

NFION 1.5W/M.K One-part Thermal Gel is a cutting-edge thermal interface material designed to efficiently manage and dissipate heat in electronic devices. This high-performance gel addresses the critical need for effective thermal management, ensuring optimal device performance and longevity. It offers a seamless solution for heat dissipation, providing users with peace of mind and improved reliability for their electronic products.

Features

High Thermal Conductivity: With a thermal conductivity of 1.5W/M.K, this gel ensures excellent heat transfer, reducing the risk of overheating and enhancing the efficiency of electronic components.

One-part Formulation: The single-component design simplifies the application process, eliminating the need for mixing and curing, thus saving time and reducing the potential for errors.

High Stability and Reliability: The gel maintains its thermal performance over a wide temperature range, ensuring consistent and reliable operation even in demanding conditions.

Low Thermal Resistance: The gel minimizes thermal resistance at the interface, ensuring efficient heat transfer between components and heatsinks.

Non-corrosive and Non-toxic: Safe for use in sensitive electronic applications, the gel is non-corrosive and does not pose any health hazards.


Application method

Direct Application: The gel can be directly applied to the desired surface using a dispensing tool or a spatula.

No Curing Required: As a one-part gel, it requires no curing time, making it ready for immediate use after application.

Reworkable: If necessary, the gel can be easily removed and reapplied without compromising its performance.
Application
Consumer Electronics: Ideal for use in smartphones, tablets, and other portable devices to manage heat generated by high-performance processors and batteries.
Telecommunications: Suitable for base stations, routers, and other communication equipment to ensure reliable operation in varying environmental conditions.
Automotive Electronics: Perfect for electric vehicle battery packs, control units, and other automotive components requiring efficient thermal management.
LED Lighting: Ensures optimal performance and longevity of LED modules by effectively dissipating heat.
Industrial Equipment: Applicable in power supplies, motor drives, and other industrial devices where effective heat management is crucial for maintaining performance and safety.
Specification
Testing Item Unit Testing Value Testing Method
Component - Silicone&Thermal Powder -
Colour - White or Customized Visual
Density G/CC 2.3 ASTM D1475
Thermal Resistance ℃*IN2/W 0.18 ASTM D5470
Extrusion Flow Rate G/MIN 35 2.54MM 90PSI
Weight Loss % 0.5 @200℃240H
Voltage Resistivity Ω·CM >1*1013 ASTM D257
Working Temperature -40~200 EN344
Mini interface Thickness MM 0.09 -
Flammability - V-0 UL 94
Thermal Conductivity W/M.K 1.5 ASTM D5470
SpecificationsBrochure
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