NFION 1.5W/M.K One-part Thermal Gel is a cutting-edge thermal interface material designed to efficiently manage and dissipate heat in electronic devices. This high-performance gel addresses the critical need for effective thermal management, ensuring optimal device performance and longevity. It offers a seamless solution for heat dissipation, providing users with peace of mind and improved reliability for their electronic products.
High Thermal Conductivity: With a thermal conductivity of 1.5W/M.K, this gel ensures excellent heat transfer, reducing the risk of overheating and enhancing the efficiency of electronic components.
One-part Formulation: The single-component design simplifies the application process, eliminating the need for mixing and curing, thus saving time and reducing the potential for errors.
High Stability and Reliability: The gel maintains its thermal performance over a wide temperature range, ensuring consistent and reliable operation even in demanding conditions.
Low Thermal Resistance: The gel minimizes thermal resistance at the interface, ensuring efficient heat transfer between components and heatsinks.
Direct Application: The gel can be directly applied to the desired surface using a dispensing tool or a spatula.
No Curing Required: As a one-part gel, it requires no curing time, making it ready for immediate use after application.
Testing Item | Unit | Testing Value | Testing Method |
Component | - | Silicone&Thermal Powder | - |
Colour | - | White or Customized | Visual |
Density | G/CC | 2.3 | ASTM D1475 |
Thermal Resistance | ℃*IN2/W | 0.18 | ASTM D5470 |
Extrusion Flow Rate | G/MIN | 35 | 2.54MM 90PSI |
Weight Loss | % | <0.5 | @200℃240H |
Voltage Resistivity | Ω·CM | >1*1013 | ASTM D257 |
Working Temperature | ℃ | -40~200 | EN344 |
Mini interface Thickness | MM | 0.09 | - |
Flammability | - | V-0 | UL 94 |
Thermal Conductivity | W/M.K | 1.5 | ASTM D5470 |