The 2.0W/M.K One-part Thermal Gel is a superior thermal interface material engineered to provide enhanced heat dissipation for advanced electronic devices. With higher thermal conductivity than its 1.5W/M.K counterpart, this gel addresses the escalating thermal management needs of high-performance applications, ensuring devices run cooler and more efficiently. It delivers unparalleled value by extending device lifespan and improving reliability through superior heat transfer.
● Enhanced Thermal Conductivity: Featuring a thermal conductivity of 2.0W/M.K, this gel significantly improves heat transfer efficiency, crucial for high-power and high-density electronic components.
● Single-component Design: Simplifies application processes by eliminating the need for mixing, thereby reducing preparation time and potential application errors.
● Superior Stability and Reliability: Maintains exceptional thermal performance across a broad temperature range, ensuring consistent and dependable operation even under challenging conditions.
● Low Thermal Resistance: Ensures minimal thermal resistance at the interface, maximizing the efficiency of heat dissipation between components and heatsinks.
● Automated Dispensing: Supports automated dispensing equipment for precise and efficient application, ideal for mass production and high-volume manufacturing.
● Direct Application: Can be directly applied to surfaces using a dispensing tool or spatula for manual operations.
● No Curing Needed: As a one-part gel, it is ready for use immediately after application without the need for curing time.
Testing Item | Unit | Testing Value | Testing Method |
Component | - | Silicone&Thermal Powder | - |
Colour | - | Pink or Customized | Visual |
Density | G/CC | 2.6(±0.5) | ASTM D 792 |
Thermal Resistance | ℃*IN2/W | 0.15 | ASTM D5470 |
Extrusion Flow Rate | G/MIN | 25 | g/min(50MPa) |
40 | g/min(100MPa) | ||
Weight Loss | % | <0.5 | @200℃240H |
Voltage Resistivity | Ω·CM | >1*1013 | ASTM D257 |
Working Temperature | ℃ | -40~200 | IEC 60068-2-14 |
Breakdown Voltage | K v/mm | ≥7 | ASTM D 149 |
Mini interface Thickness | MM | 0.09 | - |
Flammability | - | V-0 | UL 94 |
Thermal Conductivity | W/M.K | 2.0 | ASTM D5470 |