2.0W/M.K One-part Thermal Gel
2.0W/M.K One-part Thermal Gel

2.0W/M.K One-part Thermal Gel

2.0W/M.K One-part Thermal Gel
Conductivity:2.0W/M.K
Working Temperature:-40-200℃
Certification : UL,ROHS, REACH
Conductivity:2.0W/M.K
Working Temperature:-40-200℃
Certification : UL,ROHS, REACH
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2.0W/M.K One-part Thermal Gel Apply For Quotation
Introduction

The 2.0W/M.K One-part Thermal Gel is a superior thermal interface material engineered to provide enhanced heat dissipation for advanced electronic devices. With higher thermal conductivity than its 1.5W/M.K counterpart, this gel addresses the escalating thermal management needs of high-performance applications, ensuring devices run cooler and more efficiently. It delivers unparalleled value by extending device lifespan and improving reliability through superior heat transfer.





Features


● Enhanced Thermal Conductivity: Featuring a thermal conductivity of 2.0W/M.K, this gel significantly improves heat transfer efficiency, crucial for high-power and high-density electronic components.

● Single-component Design: Simplifies application processes by eliminating the need for mixing, thereby reducing preparation time and potential application errors.

● Superior Stability and Reliability: Maintains exceptional thermal performance across a broad temperature range, ensuring consistent and dependable operation even under challenging conditions.

● Low Thermal Resistance: Ensures minimal thermal resistance at the interface, maximizing the efficiency of heat dissipation between components and heatsinks.

● Non-corrosive and Safe: Designed to be non-corrosive and non-toxic, making it suitable for use in sensitive electronic environments without health hazards.


Application method

● Automated Dispensing: Supports automated dispensing equipment for precise and efficient application, ideal for mass production and high-volume manufacturing.

● Direct Application: Can be directly applied to surfaces using a dispensing tool or spatula for manual operations.

● No Curing Needed: As a one-part gel, it is ready for use immediately after application without the need for curing time.

● Reworkable: Easily removable and reapplicable without degrading performance, allowing for adjustments as needed.
Application
High-performance Consumer Electronics: Perfect for laptops, gaming consoles, and other high-performance consumer electronics that generate significant heat.
Advanced Telecommunications Equipment: Suitable for use in servers, data centers, and other high-power communication devices requiring efficient thermal management.
Automotive Electronics: Ideal for electric vehicle power control units, battery systems, and other components demanding superior heat dissipation.
High-power LED Lighting: Ensures efficient heat management in high-power LED applications, improving performance and lifespan.
Industrial and Power Electronics: Applicable in high-power industrial equipment and power electronics where effective thermal management is critical for safety and performance.
Specification
Testing Item Unit Testing Value Testing Method
Component - Silicone&Thermal Powder -
Colour - Pink or Customized Visual
Density G/CC 2.6(±0.5) ASTM D 792
Thermal Resistance ℃*IN2/W 0.15 ASTM D5470
Extrusion Flow Rate G/MIN 25 g/min(50MPa)
40 g/min(100MPa)
Weight Loss % 0.5 @200℃240H
Voltage Resistivity Ω·CM >1*1013 ASTM D257
Working Temperature -40~200 IEC 60068-2-14
Breakdown Voltage K v/mm ≥7 ASTM D 149
Mini interface Thickness MM 0.09 -
Flammability - V-0 UL 94
Thermal Conductivity W/M.K 2.0 ASTM D5470
SpecificationsBrochure
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2.0W/M.K One-part Thermal Gel Email:info@nfion.com