● Superior Thermal Conductivity: Boasting a thermal conductivity of 3.0W/M.K, this gel ensures rapid and efficient heat transfer, critical for high-power applications.
● Simplified Application: The one-part formulation eliminates the need for mixing, streamlining the application process and reducing preparation time.
● Excellent Thermal Stability: Maintains high performance across an extensive temperature range, ensuring reliable operation even under extreme conditions.
● Ultra-low Thermal Resistance: Minimizes thermal resistance at the interface, enhancing heat transfer efficiency between components and heatsinks.
● Automated Dispensing: Compatible with automated dispensing equipment for precise and efficient application, perfect for high-volume manufacturing.
● Direct Manual Application: Can be manually applied using a dispensing tool or spatula for smaller scale or custom applications.
● No Curing Time Needed: Ready for use immediately after application, eliminating the need for additional curing time.
Testing Item | Unit | Testing Value | Testing Method |
Component | - | Silicone&Thermal Powder | - |
Colour | - | Pink or Customized | Visual |
Density | G/CC | 3.2(±0.5) | ASTM D 792 |
viscosity | ( mPa.s@25℃) | 80*104 | Rheometer DHR-2 |
Thermal Resistance | ℃*IN2/W | 0.1 | ASTM D5470 |
Extrusion Flow Rate | G/MIN | 20 | g/min(50MPa) |
30 | g/min(100MPa) | ||
Weight Loss | % | <0.5 | @200℃240H |
Voltage Resistivity | Ω·CM | >1*1013 | ASTM D257 |
Working Temperature | ℃ | -40~200 | IEC 60068-2-14 |
Mini interface Thickness | MM | 0.09 | - |
Flammability | - | V-0 | UL 94 |
Thermal Conductivity | W/M.K | 4.0 | ASTM D5470 |