4.0W/M.K One-part Thermal Gel
4.0W/M.K One-part Thermal Gel

4.0W/M.K One-part Thermal Gel

4.0W/M.K One-part Thermal Gel
Conductivity:4.0W/M.K
Working Temperature:-40-200℃
Certification:UL,ROHS,REACH
Conductivity:4.0W/M.K
Working Temperature:-40-200℃
Certification:UL,ROHS,REACH
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4.0W/M.K One-part Thermal Gel Apply For Quotation
Introduction
NFION 4.0W/M.K One-part Thermal Gel is a state-of-the-art thermal interface material engineered to meet the thermal management needs of the most demanding electronic applications. This high-performance gel offers superior heat dissipation, addressing the challenges of overheating and thermal regulation in high-power devices. It provides exceptional value by ensuring optimal performance, reliability, and longevity of electronic components.

Features


●   Superior Thermal Conductivity: Boasting a thermal conductivity of 3.0W/M.K, this gel ensures rapid and efficient heat transfer, critical for high-power applications.

●   Simplified Application: The one-part formulation eliminates the need for mixing, streamlining the application process and reducing preparation time.

●   Excellent Thermal Stability: Maintains high performance across an extensive temperature range, ensuring reliable operation even under extreme conditions.

●   Ultra-low Thermal Resistance: Minimizes thermal resistance at the interface, enhancing heat transfer efficiency between components and heatsinks.

●   Safe and Non-toxic: Designed to be non-corrosive and non-toxic, ensuring safety for sensitive electronic applications without health risks.


Application method

●  Automated Dispensing: Compatible with automated dispensing equipment for precise and efficient application, perfect for high-volume manufacturing.

●  Direct Manual Application: Can be manually applied using a dispensing tool or spatula for smaller scale or custom applications.

●  No Curing Time Needed: Ready for use immediately after application, eliminating the need for additional curing time.

●  Reworkable: Easily removable and reapplicable, allowing for modifications without compromising performance.
Application
● High-performance Computing: Ideal for cooling CPUs, GPUs, and other components in high-performance computers and servers.
● Telecommunication Infrastructure: Suitable for use in high-power telecommunication devices, including base stations and data centers, requiring effective heat management.
● Automotive and Electric Vehicles: Perfect for thermal management in EV battery packs, power control units, and other automotive electronics demanding superior heat dissipation.
● LED and Lighting Systems: Ensures optimal performance and longevity in high-intensity LED lighting systems by efficiently managing heat.
● Renewable Energy Systems: Applicable in solar inverters, wind turbines, and other renewable energy systems where effective thermal management is crucial for maintaining performance and safety.
Specification
Testing Item Unit Testing Value Testing Method
Component - Silicone&Thermal Powder -
Colour - Pink or Customized Visual
Density G/CC 3.2(±0.5) ASTM D 792
viscosity ( mPa.s@25) 80*104 Rheometer DHR-2
Thermal Resistance *IN2/W 0.1 ASTM D5470
Extrusion Flow Rate G/MIN 20 g/min(50MPa)
30 g/min(100MPa)
Weight Loss % 0.5 @200240H
Voltage Resistivity Ω·CM >1*1013 ASTM D257
Working Temperature -40~200 IEC 60068-2-14
Mini interface Thickness MM 0.09 -
Flammability - V-0 UL 94
Thermal Conductivity W/M.K 4.0  ASTM D5470
SpecificationsBrochure
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