● Exceptional Thermal Conductivity: With a thermal conductivity of 3.0W/M.K, this gel delivers outstanding heat dissipation, essential for high-power and high-density electronic components.
● One-part Formulation: Its single-component design simplifies application, eliminating the need for mixing and reducing preparation time.
● High Thermal Stability: Ensures excellent performance across a wide temperature range, maintaining reliable operation under extreme conditions.
● Ultra-low Thermal Resistance: Provides minimal thermal resistance at the interface, maximizing heat transfer efficiency between components and heatsinks.
Testing Item | Unit | Testing Value | Testing Method |
Component | - | Silicone&Thermal Powder | - |
Colour | - | Blue or Customized | Visual |
Density | G/CC | 2.9(±0.5) | ASTM D 792 |
Thermal Resistance | ℃*IN2/W | 0.12 | ASTM D5470 |
Viscosity | ( mPa.s@25℃) | 75*104 | Rheometer DHR-2 |
Extrusion Flow Rate | G/MIN | 25 | g/min(50MPa) |
40 | g/min(100MPa) | ||
Weight Loss | % | <0.5 | @200℃240H |
Voltage Resistivity | Ω·CM | >1*1013 | ASTM D257 |
Working Temperature | ℃ | -40~200 | EN344 |
Mini interface Thickness | MM | 0.09 | - |
Flammability | - | V-0 | UL 94 |
Thermal Conductivity | W/M.K | 3.0 | ASTM D5470 |