3.0W/M.K One-part Thermal Gel
3.0W/M.K One-part Thermal Gel

3.0W/M.K One-part Thermal Gel

3.0W/M.K One-part Thermal Gel
Conductivity:3.0W/M.K
Working Temperature:-40-200℃
Certification:UL,ROHS,REACH
Conductivity:3.0W/M.K
Working Temperature:-40-200℃
Certification:UL,ROHS,REACH
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3.0W/M.K One-part Thermal Gel Apply For Quotation
Introduction
NFION 3.0W/M.K One-part Thermal Gel is an elite thermal interface material designed for the most demanding electronic applications. With exceptional thermal conductivity, this advanced gel addresses critical heat management challenges, ensuring peak performance and longevity of high-power devices. It provides unmatched value by enabling efficient thermal transfer, thus preventing overheating and ensuring consistent, reliable operation.

Features


●  Exceptional Thermal Conductivity: With a thermal conductivity of 3.0W/M.K, this gel delivers outstanding heat dissipation, essential for high-power and high-density electronic components.

●  One-part Formulation: Its single-component design simplifies application, eliminating the need for mixing and reducing preparation time.

●  High Thermal Stability: Ensures excellent performance across a wide temperature range, maintaining reliable operation under extreme conditions.

●  Ultra-low Thermal Resistance: Provides minimal thermal resistance at the interface, maximizing heat transfer efficiency between components and heatsinks.

●  Non-corrosive and Non-toxic: Safe for use in sensitive electronic environments, this gel is non-corrosive and poses no health hazards.


Application method
●  Precision Automated Dispensing: Compatible with automated dispensing systems for high-precision application, ideal for large-scale manufacturing.
●  Manual Application: Can be directly applied using a dispensing tool or spatula for manual operations.
●  No Curing Required: Ready for immediate use after application, eliminating the need for curing time.
●  Reworkable: Easily removable and reapplicable without compromising performance, allowing for adjustments as needed.
Application
● High-end Consumer Electronics: Ideal for high-end laptops, gaming consoles, and other devices with substantial heat generation requiring superior thermal management.
● Advanced Telecommunications Equipment: Suitable for high-power servers, data centers, and other communication devices needing efficient heat dissipation.
● Automotive Electronics: Perfect for electric vehicle powertrain components, battery management systems, and other automotive electronics demanding excellent thermal performance.
● High-intensity LED Lighting: Ensures effective heat management in high-intensity LED applications, enhancing performance and lifespan.
● Aerospace and Defense Electronics: Applicable in critical aerospace and defense systems where superior thermal management is essential for reliability and performance.
Specification
Testing Item Unit Testing Value Testing Method
Component - Silicone&Thermal Powder -
Colour - Blue or Customized Visual
Density G/CC 2.9(±0.5) ASTM D 792
Thermal Resistance ℃*IN2/W 0.12 ASTM D5470
Viscosity ( mPa.s@25℃) 75*104 Rheometer DHR-2
Extrusion Flow Rate G/MIN 25 g/min(50MPa)
40 g/min(100MPa)
Weight Loss % 0.5 @200℃240H
Voltage Resistivity Ω·CM >1*1013 ASTM D257
Working Temperature -40~200 EN344
Mini interface Thickness MM 0.09 -
Flammability - V-0 UL 94
Thermal Conductivity W/M.K 3.0  ASTM D5470
SpecificationsBrochure
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3.0W/M.K One-part Thermal Conductive Gel Email:info@nfion.com