● Outstanding Thermal Conductivity: With a thermal conductivity of 6.5W/M.K, this gel enables rapid and efficient heat transfer, essential for demanding electronic components.
● Single-component Design: Simplifies application without the need for mixing, reducing application time and potential errors.
● High Thermal Stability: Maintains peak performance across a broad temperature range, ensuring reliable operation in diverse environments.
● Low Thermal Resistance: Minimizes thermal resistance at interfaces, maximizing heat dissipation efficiency between components and heatsinks.
● Precision Automated Dispensing: Compatible with automated dispensing systems for accurate and efficient application in high-volume manufacturing.
● Manual Application: Can be applied using dispensing tools or spatulas for smaller-scale or customized applications.
● Immediate Use: Ready for immediate application, eliminating the need for curing time and facilitating rapid deployment.
Feature | Value | Unit | Test Method |
Thermal Conductivity | 6.5(±0.3) | W/m·K | ASTM D5470 |
Thermal Impedance | ≤0.5 | ℃-in2/W | ASTM D5470 |
Color | Grey | -- | Visual |
Viscosity | 85*104 | mPa.s@25℃ | Rheometer DHR-2 |
Density | 3.4(±0.5) | g/cc | ASTM D792 |
Extrusion Speed | 20 | g | g/min(50Mpa) |
30 | g | g/min(100Mpa) | |
Flammability Rating | V-0 | -- | UL 94 |
Working Temperature | -50~160 | ℃ | IEC 60068-2-14 |
Breakdown Voltage | ≥7 | Kv/mm | ASTM D149 |
Volume Resistivity | ≥1.0*1011 | Ω·cm | ASTM D257 |