● Exceptional Thermal Conductivity: Boasting a thermal conductivity of 6.0W/M.K, this gel facilitates rapid and efficient heat transfer, crucial for high-power electronic components.
● Single-component Design: Simplifies application with no mixing required, reducing application time and potential errors.
● High Thermal Stability: Maintains peak performance across a wide temperature range, ensuring reliability in diverse operating conditions.
● Low Thermal Resistance: Minimizes thermal resistance at interfaces, maximizing heat dissipation efficiency between components and heatsinks.
● Precision Automated Dispensing: Compatible with automated dispensing systems for accurate and efficient application in high-volume production.
● Direct Application: Can be applied manually using dispensing tools or spatulas for smaller scale or custom applications.
● Immediate Use: Ready for immediate use after application, eliminating the need for curing time.
Testing Item | Unit | Testing Value | Testing Method |
Component | - | Silicone&Thermal Powder | - |
Colour | - | Gray or Customized | Visual |
Density | G/CC | 3.4(±0.5) | ASTM D 792 |
Thermal Resistance | ℃*IN2/W | 0.06 | ASTM D5470 |
Viscosity | ( mPa.s@25℃) | 85*104 | Rheometer DHR-2 |
Extrusion Flow Rate | G/MIN | 20 | g/min(50MPa) |
G/MIN | 30 | g/min(100MPa) | |
Weight Loss | % | <0.5 | @200℃240H |
Voltage Resistivity | Ω·CM | >1*1013 | ASTM D257 |
Working Temperature | ℃ | -40~200 | IEC 60068-2-14 |
Mini interface Thickness | MM | 0.09 | - |
Flammability | - | V-0 | UL 94 |
Thermal Conductivity | W/M.K | 6.0 | ASTM D5470 |