0.5mm Double Sided Thermal Resistant Tape-NFION

0.5mm Thermal Conductive Adhesive Tape

Adhesive：Acrylic
Thickness：0.5MM
Material：Glass fiber
Thermal Conductivity：1.2W/m.k
Adhesive Type：Pressure Sensitive
Temperature Resistance：-20-120℃
Breakdown Voltage：≥7Kv/mm

Introduction

NFION 0.5mm Thermal Conductive Adhesive Tape features a fiberglass base and a dual-sided adhesive layer, providing exceptional bonding and heat transfer capabilities. With a thermal conductivity of 1.2W/m.k and the ability to function effectively in temperatures from -20 to 120℃, this tape is designed for applications where robust thermal management is crucial. It is ideal for use between heat-generating components and heat sinks, or within electronic assemblies that require secure, long-lasting thermal interfaces. This tape resolves overheating issues, ensuring consistent performance and extending the lifespan of electronic devices.

Features

● Dual-Sided Adhesion: Offers strong bonding on both sides, ensuring reliable thermal interface.

● High Thermal Conductivity: Efficiently transfers heat with a thermal conductivity of 1.2W/m.k.

● Temperature Tolerance: Operates effectively in a wide temperature range from -20 to 120℃.

● Tear Resistance: Enhanced durability with resistance to tearing, thanks to the fiberglass base.

● Robust Adhesion: Provides superior adhesion strength to a variety of surfaces.

● Flexibility and Conformability: Easily conforms to irregular surfaces for comprehensive coverage.

Application method

Surface Preparation: Clean and dry the surfaces to be bonded, ensuring they are free from dust, oil, and contaminants.

Tape Cutting: Cut the tape to the appropriate size for your application.

Peeling and Placement: Peel off the protective liners from both sides of the tape and position it between the heat-generating component and the heat sink or other surfaces.

Pressure Application: Apply firm pressure to ensure full contact and secure adhesion.

Curing Time: Allow the adhesive to set as per the manufacturer's recommendations to achieve optimal performance.

Application

● Power Electronics: Ideal for use in power converters and modules where efficient heat transfer is critical.
● Computer Components: Enhances thermal management in CPUs, GPUs, and other high-performance computing elements.
● Consumer Electronics: Applied in smartphones, tablets, and other devices to manage heat effectively.
● Industrial Machinery: Ensures reliable heat dissipation in various types of industrial equipment.
● Telecommunications Hardware: Manages heat in communication devices and networking equipment.

Specification

Testing Item	Unit	Testing Value	Testing Method
Substrate	-	Glass Fabric	-
Colour	-	White	Visual
Thickness	MM	0.5	-
Peel Strength under 180°	(PSTC-101)(N/25MM)	＞19	PSTC-1
Retention	（1KG/INCH/25℃）	＞48	PSTC-1
Adhesion	KG/IN	1.5	PSTC-1
Initial Viscosity	KG/IN	1.5	PSTC-1
Breakdown Voltage	KV/MM	7	ASTM D149
Long-term Highest Temperature resistance	℃	80	EN 344
Short-term Highest Temperature	℃	120	EN 344
Working Temperature	℃	-20～120	EN 344
Conductivity	W/M.K	≥1.2	ASTM D5470