0.25mm Thermal Conductive Adhesive Tape

0.25mm Thermal Conductive Adhesive Tape
Adhesive:Acrylic
Thickness:0.25MM
Material:Glass fiber
Thermal Conductivity:1.2W/m.k
Adhesive Type:Pressure Sensitive
Temperature Resistance:-20-120℃
Breakdown Voltage:≥4Kv/mm
Adhesive:Acrylic
Thickness:0.25MM
Material:Glass fiber
Thermal Conductivity:1.2W/m.k
Adhesive Type:Pressure Sensitive
Temperature Resistance:-20-120℃
Breakdown Voltage:≥4Kv/mm
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Introduction
NFION 0.25mm Thermal Conductive Adhesive Tape is engineered for long-term operation in temperatures ranging from -20 ~ 120℃. This tape is ideal for application between heat-generating electronic components and heat sinks or metal casings. It effectively addresses the problem of overheating, which can cause reduced efficiency, hardware damage, and system failures. By using our thermal conductive adhesive tape, users benefit from enhanced thermal management, improved device performance, and extended product lifespan.
Features

●  Superior Adhesion: Provides strong and durable bonding to various surfaces.

●  Thermal Conductivity: Features a thermal conductivity of 1.2W/m.k, ensuring efficient heat transfer.

●  Temperature Resilience: Designed to withstand extreme high and low temperatures.

●  Flexibility and Conformability: Easily adapts to irregular surfaces for thorough coverage.

●  Thin and Effective: With a thickness of 0.25mm, it offers efficient thermal management without compromising space.

●  Electrical Insulation: Ensures safe operation by providing reliable electrical insulation.
Application method

●  Surface Preparation: Clean and dry the surfaces to be bonded, removing any dust, grease, or other contaminants.

●  Tape Application: Cut the tape to the desired length and remove the protective liner.

●  Positioning: Carefully place the tape on the intended surface, ensuring proper alignment and a smooth, bubble-free application.

●  Pressure Application: Apply firm, even pressure to the tape to ensure a strong bond and optimal surface contact.

●  Curing (if required): Allow the adhesive to cure for the recommended duration to achieve maximum bonding strength.

Application
● ​LED Lighting Systems: Enhances heat dissipation in LED modules, leading to better performance and longer lifespan.
● ​Consumer Electronics: Ideal for smartphones, tablets, and laptops to ensure effective thermal management.
● ​Power Electronics: Ensures efficient heat transfer in power supplies and related components.
● ​Automotive Electronics: Manages heat in vehicle control units and sensors, ensuring reliable performance.
● ​Industrial Equipment: Provides thermal management solutions for various industrial machines and devices.
Specification
Testing Item Unit Testing Value Testing Method
Substrate - Glass Fabric -
Colour - White Visual
Thickness MM 0.25 -
Peel Strength under 180° (PSTC-101)(N/25MM) 16 PSTC-1
Retention 1KG/INCH/25°C 48 PSTC-1
Adhesion KG/IN 1.4 PSTC-1
Initial Viscosity KG/IN 1.3 PSTC-1
Breakdown Voltage KV/MM 4 ASTMD149
Long-term Highest Temperature resistance 80 EN344
Short-term Highest Temperature 120 EN344
Working Temperature -20120 EN344
Conductivity W/M.K ≥1.2 ASTMD5470
SpecificationsBrochure
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