● Superior Adhesion: Provides strong and durable bonding to various surfaces.
● Thermal Conductivity: Features a thermal conductivity of 1.2W/m.k, ensuring efficient heat transfer.
● Temperature Resilience: Designed to withstand extreme high and low temperatures.
● Flexibility and Conformability: Easily adapts to irregular surfaces for thorough coverage.
● Thin and Effective: With a thickness of 0.25mm, it offers efficient thermal management without compromising space.
● Surface Preparation: Clean and dry the surfaces to be bonded, removing any dust, grease, or other contaminants.
● Tape Application: Cut the tape to the desired length and remove the protective liner.
● Positioning: Carefully place the tape on the intended surface, ensuring proper alignment and a smooth, bubble-free application.
● Pressure Application: Apply firm, even pressure to the tape to ensure a strong bond and optimal surface contact.
● Curing (if required): Allow the adhesive to cure for the recommended duration to achieve maximum bonding strength.
| Testing Item | Unit | Testing Value | Testing Method |
| Substrate | - | Glass Fabric | - |
| Colour | - | White | Visual |
| Thickness | MM | 0.25 | - |
| Peel Strength under 180° | (PSTC-101)(N/25MM) | >16 | PSTC-1 |
| Retention | (1KG/INCH/25°C) | >48 | PSTC-1 |
| Adhesion | KG/IN | 1.4 | PSTC-1 |
| Initial Viscosity | KG/IN | 1.3 | PSTC-1 |
| Breakdown Voltage | KV/MM | 4 | ASTMD149 |
| Long-term Highest Temperature resistance | ℃ | 80 | EN344 |
| Short-term Highest Temperature | ℃ | 120 | EN344 |
| Working Temperature | ℃ | -20~120 | EN344 |
| Conductivity | W/M.K | ≥1.2 | ASTMD5470 |