● High Thermal Conductivity: Efficiently transfers heat to ensure optimal performance and longevity of electronic components.
● Strong Adhesion: Provides excellent bonding strength to various surfaces, ensuring durability and stability.
● Flexibility and Conformability: Easily conforms to irregular surfaces and contours for versatile application.
● Thin Profile: At just 0.15mm thick, it allows for compact and efficient heat management solutions.
1、Surface Preparation: Ensure that the surfaces to be bonded are clean, dry, and free from dust and grease.
2、Tape Application: Cut the tape to the desired length and remove the protective liner.
3、Positioning: Carefully position the tape on the target surface, ensuring alignment and avoiding wrinkles or air bubbles.
4、Pressure Application: Apply firm pressure to the tape to ensure good adhesion and contact with the surface.
Testing Item | Unit | Testing Value | Testing Method |
Substrate | - | Glass Fabric | - |
Colour | - | White | Visual |
Thickness | MM | 0.15 | - |
Peel Strength under 180° | (PSTC-101)(N/25MM) | >14 | PSTC-1 |
Retention | (1KG/INCH/25°C) | >48 | PSTC-1 |
Adhesion | KG/IN | 1.4 | PSTC-1 |
Initial Viscosity | KG/IN | 1.3 | PSTC-1 |
Breakdown Voltage | KV/MM | 2.5 | ASTMD149 |
Long-term Highest Temperature resistance | °C | 80 | EN344 |
Short-term Highest Temperature | °C | 120 | EN344 |
Working Temperature | °C | -20°C~120°C | EN344 |
Conductivity | W/M.K | ≥1.2 | ASTMD5470 |