● High Thermal Conductivity: 1.2W/m.k, ensuring effective heat transfer and dissipation.
● Strong Adhesion: Delivers excellent bonding strength to diverse surfaces.
● Temperature Resilience: Capable of withstanding extreme high and low temperatures.
● Flexibility and Conformability: Adapts easily to various surface contours and shapes.
● Thin Profile: At 0.3mm thickness, it provides efficient thermal management without occupying significant space.
1、Surface Preparation: Ensure the surfaces to be bonded are clean, dry, and free from dust, grease, and other contaminants.
2、Tape Application: Cut the tape to the required size and remove the protective liner.
3、Positioning: Accurately position the tape on the target surface, avoiding wrinkles and air bubbles.
4、Pressure Application: Apply firm and even pressure to the tape to secure a strong bond and optimal contact.
5、Curing (if required): Allow the adhesive to cure for the specified time to achieve maximum bonding strength.Testing Item | Unit | Testing Value | Testing Method |
Substrate | - | Glass Fabric | - |
Colour | - | White | Visual |
Thickness | MM | 0.3 | - |
Peel Strength under 180° | (PSTC-101)(N/25MM) | >17 | PSTC-1 |
Retention | (1KG/INCH/25℃) | >48 | PSTC-1 |
Adhesion | KG/IN | 1.5 | PSTC-1 |
Initial Viscosity | KG/IN | 1.3 | PSTC-1 |
Breakdown Voltage | KV/MM | 6 | ASTMD149 |
Long-term Highest Temperature resistance | ℃ | 80 | EN344 |
Short-term Highest Temperature | ℃ | 120 | EN344 |
Working Temperature | ℃ | -20~120 | EN344 |
Conductivity | W/M.K | ≥1.2 | ASTM D5470 |