0.4mm High Temperature Double Sided Heat Dissipation Tape-NFION

0.4mm Thermal Conductive Adhesive Tape

Adhesive：Acrylic
Thickness：0.4MM
Material：Glass fiber
Thermal Conductivity：1.2W/m.k
Adhesive Type：Pressure Sensitive
Temperature Resistance：-20-120℃
Breakdown Voltage：≥6.5Kv/mm

Introduction

NFION 0.4mm Thermal Conductive Adhesive Tape is crafted using a fiberglass base, providing robust durability and flexibility. With a thermal conductivity of 1.2W/m.k and the ability to perform reliably in temperatures ranging from -20 ~ 120℃, this tape is ideal for applications requiring efficient heat dissipation and structural integrity. It is particularly suited for use in areas where components generate significant heat and need stable thermal management, such as between heat sinks and electronic components. This tape helps to prevent overheating, ensuring optimal performance and longevity of devices, thereby delivering substantial value to users.

Features

● Strong Adhesion: Provides excellent bonding strength to a variety of surfaces.

● Thermal Conductivity: Ensures effective heat transfer with a thermal conductivity of 1.2W/m.k.

● Temperature Resilience: Capable of withstanding high and low temperature extremes.

● Tear Resistance: Enhanced durability with resistance to tearing, thanks to the fiberglass cloth base.

● Flexibility and Conformability: Easily adapts to various shapes and surfaces.

● Thin Profile: At 0.4mm thickness, it offers efficient thermal management without taking up too much space.

Application method

●  Surface Preparation: Clean and dry the surfaces to be bonded, removing dust, grease, and other contaminants.
●  Tape Application: Cut the tape to the desired length and peel off the protective liner.
●  Positioning: Accurately place the tape on the target surface, ensuring smooth application without wrinkles or air bubbles.
●  Pressure Application: Apply even and firm pressure across the tape to ensure a strong bond and optimal contact.
●  Curing (if necessary): Allow the adhesive to cure as per the recommended duration for maximum bonding strength.

Application

● Computer and Server Systems: Enhances heat dissipation in CPUs and GPUs, maintaining optimal operating temperatures.
● Medical Devices: Ensures reliable thermal management in sensitive electronic medical equipment.
● Telecommunication Equipment: Provides effective heat transfer in networking hardware and devices.
● Renewable Energy Systems: Manages heat in solar panels and wind turbine components.
● Aerospace Electronics: Offers robust thermal management in avionics and other aerospace electronic systems.

Specification

Testing Item	Unit	Testing Value	Testing Method
Substrate	-	Glass Fabric	-
Colour	-	White	Visual
Thickness	MM	0.4	-
Peel Strength under 180°	(PSTC-101)(N/25MM)	＞18	PSTC-1
Retention	（1KG/INCH/25℃）	＞48	PSTC-1
Adhesion	KG/IN	1.5	PSTC-1
Initial Viscosity	KG/IN	1.4	PSTC-1
Breakdown Voltage	KV/MM	6.5	ASTMD149
Long-term Highest Temperature resistance	℃	80	EN344
Short-term Highest Temperature	℃	120	EN344
Working Temperature	℃	-20～120	EN344
Conductivity	W/M.K	≥1.2	ASTM D5470