4.0 W/M.K Two-component Thermal Gel
4.0 W/M.K Two-component Thermal Gel

4.0 W/M.K Two-component Thermal Gel

4.0 W/M.K Two-component Thermal Gel
Thermal Conductivity:4.0W/M.K
Mixing Ratio:A:B=1:1
Curing Time:15min (100℃)
Curing Time:24H (25℃)
Temperature Range:-50~160℃
Certification:UL,ROHS,REACH
Thermal Conductivity:4.0W/M.K
Mixing Ratio:A:B=1:1
Curing Time:15min (100℃)
Curing Time:24H (25℃)
Temperature Range:-50~160℃
Certification:UL,ROHS,REACH
Contact Us
4.0 W/M.K Two-component Thermal Gel Apply For Quotation
Introduction

NFION 4.0 W/m.K Two-component Thermal Gel is a top-tier thermal interface material engineered for the most demanding electronic applications. This cutting-edge gel offers superior thermal conductivity and cures to form a solid thermal interface, providing unmatched heat dissipation capabilities. Designed for both automated and manual applications, it ensures maximum thermal efficiency and reliability for high-performance components.


The 4.0 W/m.K Two-component Thermal Gel is your ultimate solution for superior thermal management, catering to the needs of the most demanding electronic applications. Its exceptional properties and ease of application make it the preferred choice for industries requiring advanced thermal solutions.

Features

Exceptional Thermal Conductivity: Provides an impressive thermal conductivity of 4.0 W/m.K, facilitating efficient heat transfer.

● Minimal Thermal Resistance: Significantly reduces thermal impedance, optimizing the thermal management of electronic devices.

● Curing Characteristics: Transforms from a gel to a solid state upon curing, creating a durable and stable thermal interface.

● Consistent Performance: Maintains excellent thermal and mechanical stability over a wide range of temperatures and operating conditions.

● Non-Corrosive and Non-Conductive: Safe for use with sensitive electronic components, providing both thermal and electrical insulation.

● High Dielectric Strength: Ensures superior electrical insulation properties.

● Flexible Application: Compatible with both automated dispensing equipment and manual application methods, offering versatility in usage.

Application method

1、Surface Preparation: Clean the surfaces thoroughly to remove any dust, oil, or contaminants.

2、Mixing Components: Combine the two components in the specified ratio until a uniform consistency is achieved.

3、Application Process: Dispense the mixed gel evenly onto the target surfaces using an automated dispensing system or manually.

4、Curing: Allow the applied gel to cure under the recommended conditions to achieve optimal performance.
Application
● Consumer Electronics: Ideal for high-performance consumer devices such as gaming consoles, high-end laptops, and advanced smartphones.
● Automotive Electronics: Perfect for thermal management in advanced automotive systems, including ECUs, LED lighting systems, and electric vehicle battery packs.
● Telecommunications: Suitable for high-power telecom equipment such as base stations, data centers, and network servers.
● Industrial Electronics: Provides efficient thermal management for industrial control systems, power converters, and other critical industrial electronics.
● Medical Equipment: Ensures reliable thermal performance in medical imaging devices, patient monitoring systems, and other healthcare electronics.
Specification
Feature Value Unit Test Method
Part A Color Red -- Visual
Part B color White -- Visual
Density 3.15 (±0.5) g/cc ASTM D792
Mixing Ratio 1:1 -- By weight or volume
Cure Condition 24 H 25
15 Min 100
Thermal Conductivity 4.0(±0.2) W/ m·K ASTM D5470
Color Pink -- Visual
Thermal Impedance ≤0.75 -in²/W ASTM D5470
@20psi&1mm
Hardness 35 Shore C ASTM D2240
Tensile Strength ≥0.1 MPa ASTM D412
Extension Rate ≥50 % ASTM D412
Flammability Rating V-0 -- UL 94
Working Temperature -50~160 IEC 60068-2-14
Breakdown Voltage ≥10 Kv/mm ASTM D149
Volume Resistivity ≥1012 Ω·cm ASTM D257
Dielectric Constant ≥2 @1MHz ASTM D150
Dielectric loss ≤0.1 @1MHz ASTM D150
SpecificationsBrochure
  • Data
    Date Download
  • Data
    Date Download
Related Products
3.0 W/M.K Two-component Thermal Gel
3.0 W/M.K Two-component Thermal Gel
3.0 W/M.K Two-component Thermal Gel

More  >
4.0 W/M.K Two-component Thermal Gel
4.0 W/M.K Two-component Thermal Gel
4.0 W/M.K Two-component Thermal Gel

More  >
Copyright © 2020 Shenzhen Nuofeng Electronic Technology Co.,Ltd All rights reserved Sitemap
4.0 W/M.K Two-component Thermal Gel Email:info@nfion.com