2.0 W/M.K Two-component Thermal Gel-NFION

2.0 W/M.K Two-component Thermal Gel

Thermal Conductivity:2.0W/M.K
Mixing Ratio：A：B=1:1
Curing Time：15min （100℃）
Curing Time：24H （25℃）
Temperature Range:-50~160℃
Certification:UL,ROHS,REACH

Introduction

NFION 2.0 W/m.K Two-component Thermal Gel is a premium thermal interface material specifically formulated to deliver superior heat dissipation for high-performance electronic devices. This advanced thermal gel cures to form a solid material, providing thermal conductivity akin to conventional thermal silicone pads. Designed for ease of application and long-term reliability, it ensures optimal thermal management for a wide range of applications.

The 2.0 W/m.K Two-component Thermal Gel is your ideal solution for advanced thermal management, providing the reliability and performance necessary for high-demand electronic applications. Its ease of application and compatibility with automated dispensing systems make it a versatile and efficient choice for various industries.

Features

● High Thermal Conductivity: Provides excellent thermal conductivity of 2.0 W/m.K for efficient heat transfer.

● Low Thermal Resistance: Reduces thermal impedance, enhancing overall thermal management.

● Curing Characteristics: Transforms from a gel to a solid state upon curing, offering secure adhesion and consistent thermal performance similar to thermal silicone pads.

● Excellent Stability: Retains performance across a wide temperature range, ensuring long-term reliability.

● Non-Corrosive and Non-Conductive: Safe for use with delicate electronic components.

● High Dielectric Strength: Offers superior electrical insulation properties.

● Automated Dispensing Compatibility: Suitable for use with automatic dispensing equipment, facilitating precise and efficient application.

Application method

● Surface Preparation: Clean the surfaces thoroughly to remove any dust, grease, or contaminants.

● Mixing: Combine the two components of the thermal gel according to the specified ratio.

● Application: Apply the mixed gel evenly on the desired surfaces using automatic dispensing equipment or manually.

● Curing: Allow the gel to cure under the recommended conditions to achieve optimal performance.

Application

Consumer Electronics: Perfect for thermal management in smartphones, tablets, laptops, and other portable devices.
Automotive Electronics: Ideal for use in automotive control units, LED headlights, battery management systems, and other automotive electronics.
Telecommunications: Effective in managing heat in base stations, routers, servers, and other telecommunications equipment.
Industrial Equipment: Suitable for thermal management in power supplies, motor controls, and various industrial electronic devices.
Medical Devices: Ensures efficient heat dissipation in diagnostic and monitoring equipment.

Specification

Feature	Value	Unit	Test Method
Part A Color	Dark Grey	--	Visual
Part B Color	White	--	Visual
Part A Viscosity	230000±30000	Mpa.s	ASTM D2196
Part B Viscosity	240000±30000	Mpa.s	ASTM D2196
Density	2.4(±0.5)	g/cc	ASTM D792
Mixing Ratio	1:1	--	By weight or volume
Cure Condition	24	H	25℃
Cure Condition	15	Min	100℃
Thermal Conductivity	2.0(±0.2)	W/ M·K	ASTM D5470
Color	Grey	--	Visual
Thermal Impedance	≤1.0	℃-in2/W	ASTM D5470
Thermal Impedance	≤1.0	@20psi&1mm	ASTM D5470
Hardness	35±5	Shore C	ASTM D2240
Tensile Strength	≥0.1	MPa	ASTM D412
Extension Rate	≥100	%	ASTM D412
Flammability Rating	V-0	--	UL 94
Working Temperature	-50~160	℃	IEC 60068-2-14
Breakdown Voltage	≥10	Kv/mm	ASTM D149
Volume Resistivity	≥10¹²	Ω·cm	ASTM D257
Dielectric Constant	≥2	@1MHz	ASTM D150
Dielectric loss	≤0.1	@1MHz	ASTM D150