NFION 3.0 W/m.K Two-component Thermal Gel is an elite thermal interface material designed to provide exceptional heat dissipation for advanced electronic devices. This high-performance gel cures to form a soft solid, highly conductive thermal interface that rivals traditional thermal pads. Engineered for both manual and automated applications, it ensures superior thermal management for critical components.

The 3.0 W/m.K Two-component Thermal Gel offers unparalleled thermal management solutions, catering to the needs of high-performance and high-reliability applications. Its exceptional properties and ease of application make it the preferred choice for a wide range of industries seeking advanced thermal solutions.

● Superior Thermal Conductivity: Delivers outstanding thermal conductivity of 3.0 W/m.K, enabling efficient heat transfer.

● Reduced Thermal Resistance: Lowers thermal impedance, optimizing thermal performance.

● Curing Transition: Changes from a pliable gel to a solid state upon curing, creating a stable and robust thermal interface.

● Thermal and Mechanical Stability: Maintains consistent performance across a wide temperature range and under various operating conditions.

● Safe for Electronics: Non-corrosive and electrically insulating, safeguarding sensitive components.

● Enhanced Dielectric Properties: Provides excellent electrical insulation.

● Automated and Manual Application: Designed to be compatible with both automatic dispensing equipment and manual application methods for flexibility in usage.

1、Surface Preparation: Thoroughly clean surfaces to remove any dust, oil, or other contaminants.

2、Component Mixing: Mix the two components in the prescribed ratio until a uniform consistency is achieved.

3、Application Process: Dispense the mixed gel evenly onto the target surfaces using an automated dispensing system or manually.

Consumer Electronics: Ideal for enhancing thermal management in high-performance devices such as gaming laptops, smartphones, and tablets.
Automotive Electronics: Perfect for use in advanced automotive systems, including ECUs, LED lighting systems, and electric vehicle battery packs.
Telecommunications: Suitable for heat dissipation in high-power telecom equipment like base stations, data centers, and network servers.
Industrial Electronics: Provides efficient thermal management for industrial control systems, power converters, and other critical industrial electronics.
Medical Equipment: Ensures reliable thermal performance in medical imaging devices, patient monitoring systems, and other healthcare electronics.