1.0 W/M.K Two-component Thermal Gel
1.0 W/M.K Two-component Thermal Gel

1.0 W/M.K Two-component Thermal Gel

1.0 W/M.K Two-component Thermal Gel
Thermal Conductivity:1.0 W/M.K
Mixing Ratio:A:B=1:1
Curing Time:15min (100℃)
Curing Time:24H (25℃)
Temperature Range:-50~160℃
Certification:UL,ROHS,REACH
Thermal Conductivity:1.0 W/M.K
Mixing Ratio:A:B=1:1
Curing Time:15min (100℃)
Curing Time:24H (25℃)
Temperature Range:-50~160℃
Certification:UL,ROHS,REACH
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1.0 W/M.K Two-component Thermal Gel Apply For Quotation
Introduction

NFION 1.0 W/m.K Two-component Thermal Gel is an advanced thermal interface material engineered for efficient heat dissipation in electronic devices. This gel features a unique formulation that, after curing, exhibits thermal conductivity properties comparable to traditional thermal silicone pads. It is designed to provide excellent thermal stability and reliability in demanding applications.

The 1.0 W/m.K Two-component Thermal Gel provides a durable and efficient solution for thermal management, ensuring consistent performance similar to thermal silicone pads post-curing. It is designed to meet the stringent demands of modern electronic applications, offering reliability and ease of integration with automated dispensing equipment.

Features

High Thermal Conductivity: Offers thermal conductivity of 1.0 W/m.K, ensuring effective heat transfer.

● Low Thermal Resistance: Minimizes thermal impedance for enhanced thermal management.

● Stable Performance: Maintains consistent thermal conductivity over a wide range of temperatures.

● Curing Characteristics: Transforms from a fluid gel to a solid form after curing, providing secure adhesion and reliable thermal performance.

● Compatibility with Automated Dispensing Equipment: Designed for use with automatic dispensing systems, ensuring precise and efficient application.

● Non-Corrosive and Non-Conductive: Safe for use with sensitive electronic components.

● Versatile Application: Suitable for various electronic devices requiring efficient thermal management.

Application method

1、Prepare surfaces by cleaning thoroughly to remove contaminants.

2、Mix the two components of the gel in the specified ratio.

3、Apply the mixed gel evenly onto the surfaces using automatic dispensing equipment or manual methods.

4、Allow the gel to cure according to recommended curing conditions for optimal performance.
Application
Consumer Electronics: Ideal for smartphones, tablets, laptops, and other portable devices.
Automotive Electronics: Used in automotive control units, LED headlights, and battery management systems.
Telecommunications: Applied in base stations, routers, and servers for reliable thermal management.
Industrial Equipment: Suitable for power supplies, motor controls, and industrial electronics.
Medical Devices: Ensures efficient heat dissipation in diagnostic and monitoring equipment.
Specification
Feature Value Unit Test Method
Part A Color Grey -- Visual
Part B Color White -- Visual
Density 2.35 (±0.5) g/cc ASTM D792
Mixing Ratio 1:1 -- By weight or volume
Cure Condition 24 H 25
15 Min 100
Thermal Conductivity 1.0(±0.2) W/ m·K ASTM D5470
Color Grey -- Visual
Thermal Impedance ≤2.0 -in²/W ASTM D5470
@20psi&1mm
Hardness 35 Shore C ASTM D2240
Tensile Strength ≥0.25 MPa ASTM D412
Extension Rate ≥100 % ASTM D412
Flammability Rating V-0 -- UL 94
Working Temperature -50~160 IEC 60068-2-14
Breakdown Voltage ≥10 Kv/mm ASTM D149
Volume Resistivity ≥1012 Ω·cm ASTM D257
Dielectric Constant ≥2 @1MHz ASTM D150
Dielectric loss ≤0.1 @1MHz ASTM D150
SpecificationsBrochure
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1.0 W/M.K Two-component Thermal Gel Email:info@nfion.com