10W/M.K Thermal Gap Filler Pad Material-NFION

10.0W/M.K Silicone Thermal Pad

Thermal Conductivity: 10.0W/M.K
Working Temperature: -40-200℃
Thickness: 0.75-10MM or Customized
Hardness:30-50 shore C
Flaming Rating: UL94 V-0
Certificates: UL,RoHS,Reach

Introduction

The 10.0W/M.K Silicone Thermal Pad is a cutting-edge thermal solution designed to address the challenges of heat dissipation in modern, high-performance electronics. Featuring superior thermal conductivity of 10.0W/M.K, this silicone pad efficiently transfers heat away from critical components, ensuring optimal performance and extending the lifespan of electronic devices.

The key benefit of this thermal pad lies in its ability to significantly reduce operating temperatures, thereby improving the reliability and stability of electronic devices. It is a cost-effective and user-friendly solution that simplifies thermal management in demanding applications, offering customers a reliable choice for heat dissipation in high-end and power-intensive electronic products.

Features

High thermal conductivity of 10.0W/M.K for efficient heat transfer.

Excellent compressibility and conformability, providing intimate contact with heat-generating components.

Low thermal resistance, ensuring rapid heat dissipation.

Chemical and environmental stability, resistant to aging and degradation.

Non-conductive and non-corrosive, safe for use in electronic devices.

Application method

The 10.0W/M.K Silicone Thermal Pad is easy to apply. Simply place the pad between the heat source and the heat sink, ensuring that it covers the entire heat-generating area. Apply a moderate amount of pressure to ensure intimate contact and secure the pad in place.

Application

Targeted at high-power, high-end electronic devices where thermal management is paramount, our 10.0W/M.K Ultra-Conductive Silicone Thermal Pad excels in applications such as:
Gaming PCs & Workstations: For CPUs, GPUs, and high-speed memory modules.
Server & Data Center Equipment: Managing heat in densely packed server racks.
Advanced Telecommunications Infrastructure: Ensuring reliability of network equipment.
Electric Vehicles & Autonomous Systems: Power electronics, battery management systems.
Aerospace & Defense Technologies: Demanding thermal control in rigorous environments.

Specification

Testing Item	Testing Value	Testing Method
Thickness(MM)	0.75-10MM or Customized	ASTM D374
Components	Silicone Rubber &Ceramics	--
Colour	Grey or Customized	Visual
Hardness (Shore C)	30-50	ASTM D2240
Density(G/M³)	3.3±0.1	ASTM D792
Tensile Strength(KN/M)	0.1	ASTM D412
Extensibility(%)	30	ASTM D374
Working Temperature(℃)	-40~200	EN344
Breakdown Voltage(KV)	>10	ASTM D149
Volume Resistivity(Ω·CM)	1.5×10¹¹	ASTM D257
Dielectric Constant(@1MHz)	8	ASTM D150
Weight Loss ratio (%)	＜0.5	@200℃240H
Flaming Rating	V-0	UL-94
Standard Size(W*L:MM)	200X300	-
Thermal Conductivity(W/M.K)	10.0	ASTM D5470