1.0W/M.K Silicone Thermal Gap Pad-NFION

1.0W/M.K Silicone Thermal Pad

Thermal Conductivity: 1.0W/M.K
Working Temperature: -40-200℃
Thickness: 0.3-15MM or Customized
Flaming Rating: UL94 V-0
Certificates: UL,RoHS,Reach,TS16949,ISO9001,ISO14001

Introduction

Silicone thermal pads with a thermal conductivity of 1.0 W/m-K are commonly used in electronics for thermal management. They are designed to efficiently transfer heat from components like CPUs, GPUs, and power modules to heat sinks or metal enclosures, helping to prevent overheating and maintain optimal performance.

Features

Material: Typically made from silicone, which is flexible and can conform to irregular surfaces.

Thermal Conductivity: 1.0 W/m-K, which indicates a moderate ability to conduct heat.

Thickness: Available in various thicknesses, commonly ranging from 0.3 mm to 15 mm.

Electrical Insulation: Often electrically insulating, which is important for preventing short circuits in electronic devices.

Operating Temperature Range: Usually capable of operating in a wide temperature range, often from -50°C to 200°C.

Application method

Surface Preparation: Ensure that the surfaces of both the heat-generating component and the heat sink are clean and free from dust, oils, or other contaminants. Use isopropyl alcohol and a lint-free cloth to clean the surfaces if necessary.

Cutting the Pad: If the thermal pad is not pre-cut to the required size, carefully cut it to fit the surface area of the component. Use a sharp blade or scissors for a clean edge.

Peeling the Backing: Thermal pads often come with a protective film on both sides. Peel off one side of the protective film. Be careful not to touch the exposed surface to avoid contaminating it with oils from your fingers.

Positioning the Pad: Place the thermal pad onto the cleaned surface of the component with the exposed adhesive side down. Press it down gently to ensure good adhesion and to eliminate any air bubbles.

Removing the Second Backing: Peel off the protective film from the top side of the thermal pad. Again, avoid touching the exposed surface.

Mounting the Heat Sink: Align the heat sink with the component and carefully press it onto the thermal pad. Ensure that the heat sink is properly seated and that there is good contact between the surfaces.

Securing the Heat Sink: Depending on the design of your device, secure the heat sink in place using screws, clips, or other mounting mechanisms. Apply uniform pressure to ensure the thermal pad is adequately compressed.

Testing and Verification: After installation, power up the device and monitor the temperatures of the component. Ensure that the thermal pad is effectively conducting heat and that temperatures are within acceptable limits.

Application

Consumer Electronics: Used in smartphones, tablets, laptops, and gaming consoles.
Automotive Electronics: For cooling control units, sensors, and power modules.
Industrial Equipment: In machinery and equipment that generate significant heat.
LED Lighting: To manage heat in LED assemblies, ensuring longevity and performance.

Specification

Testing Item	Testing Value	Testing Method
Thickness(MM)	0.3-15MM or Customized	ASTM D374
Components	Silicone Rubber &Ceramics	--
Colour	Grey/White or Customized	Visual
Hardness (Shore C)	30±5	ASTM D2240
Density(G/M³)	1.8±0.1	ASTM D792
Tensile Strength(KN/M)	0.4	ASTM D412
Extensibility(%)	100	ASTM D374
Working Temperature(℃)	-40~200	EN344
Breakdown Voltage(KV)	>12	ASTM D149
Volume Resistivity(Ω·CM)	1.5×10¹²	ASTM D257
Dielectric Constant(@1MHz)	3.5	ASTM D150
Weight Loss Ratio (%)	＜3	@200℃240H
Flaming Rating	V-0	UL-94
Thermal Conductivity(W/M.K)	1.0	ASTM D5470