8.0W/M.K Silicone Thermal Pad
8.0W/M.K Silicone Thermal Pad

8.0W/M.K Silicone Thermal Pad

8.0W/M.K Silicone Thermal Pad
Thermal Conductivity: 8.0W/M.K
Working Temperature: -40-200℃
Thickness: 0.75-10MM or Customized
Hardness:30-50 shore C
Flaming Rating: UL94 V-0
Certificates: UL,RoHS,Reach
Thermal Conductivity: 8.0W/M.K
Working Temperature: -40-200℃
Thickness: 0.75-10MM or Customized
Hardness:30-50 shore C
Flaming Rating: UL94 V-0
Certificates: UL,RoHS,Reach
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8.0W/M.K Silicone Thermal Pad Apply For Quotation
Introduction
The 8.0 W/m·K Silicone Thermal Pad is a cutting-edge thermal interface material designed to address the challenges of heat dissipation in high-power electronic devices. With superior thermal conductivity, this pad ensures efficient heat transfer, protecting components from overheating and enhancing overall performance. Ideal for high-end electronic applications, it offers a reliable solution to maintain optimal operating temperatures and prolong device lifespan.

Features


Exceptional Thermal Conductivity: Boasting a thermal conductivity of 8.0 W/m·K, this pad provides outstanding heat transfer, effectively dissipating heat from high-power components.

Superior Electrical Insulation: Ensures excellent dielectric strength, safeguarding sensitive electronic components from electrical shorts.

Flexible and Conformable: The pad’s softness allows it to conform to surface irregularities, ensuring better contact and improved thermal efficiency.

Durability and Reliability: Resistant to environmental stressors such as moisture, temperature fluctuations, and mechanical pressure, ensuring long-term performance stability.


Application
High-Performance Servers and Data Centers: Essential for cooling high-power processors, memory modules, and power supplies, ensuring efficient operation and reliability.
Advanced Gaming Consoles: Ideal for managing the substantial heat generated by powerful CPUs and GPUs in next-generation gaming consoles.
Telecommunications Infrastructure: Perfect for base stations, network switches, and other high-power telecom equipment requiring dependable thermal management.
Electric Vehicles (EVs): Crucial for efficient heat dissipation in battery packs, inverters, and electronic control units (ECUs), enhancing performance and safety.
Medical Imaging Equipment: Vital for maintaining stable temperatures in high-power medical imaging devices, ensuring precise and reliable performance.
Industrial Automation Systems: Suitable for cooling high-power industrial control systems, motor drives, and other automation equipment, improving reliability and efficiency.
Renewable Energy Systems: Applied in solar inverters, wind turbine electronics, and other renewable energy systems, where efficient thermal management is key to optimal performance and longevity.
Specification
Testing Item Testing Value Testing Method
Thickness(MM) 0.75-10MM or Customized ASTM D374
Components Silicone Rubber &Ceramics --
Colour Grey or Customized Visual
Hardness (Shore C) 30-50 ASTM D2240
Density(G/M3) 3.3±0.1 ASTM D792
Tensile Strength(KN/M) 0.1 ASTM D412
Extensibility(%) 30 ASTM D374
Working Temperature(℃) -40~200 EN344
Breakdown Voltage(KV) >10 ASTM D149
Volume Resistivity(Ω·CM) 1.5×1011 ASTM D257
Dielectric Constant(@1MHz) 8 ASTM D150
Weight Loss ratio (%) 0.5 @200℃240H
Flaming Rating V-0 UL-94
Standard Size(W*L:MM) 200X300 -
Thermal Conductivity(W/M.K) 8.0 ASTM D5470
SpecificationsBrochure
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