7.0W/M.K Silicone Thermal Pad
7.0W/M.K Silicone Thermal Pad

7.0W/M.K Silicone Thermal Pad

7.0W/M.K Silicone Thermal Pad
Thermal Conductivity: 7.0W/M.K
Working Temperature: -40-200℃
Thickness: 0.75-10MM or Customized
Hardness:30-50 shore C
Flaming Rating: UL94 V-0
Certificates: UL,RoHS,Reach
Thermal Conductivity: 7.0W/M.K
Working Temperature: -40-200℃
Thickness: 0.75-10MM or Customized
Hardness:30-50 shore C
Flaming Rating: UL94 V-0
Certificates: UL,RoHS,Reach
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Introduction

The 7.0 W/m·K Silicone Thermal Pad is a high-performance thermal interface material designed to provide superior heat dissipation in high-power electronic applications. Made from premium silicone, this thermal pad ensures excellent thermal conductivity, making it ideal for high-end electronic devices requiring efficient thermal management.

The 7.0 W/m·K Silicone Thermal Pad is engineered to meet the rigorous thermal management requirements of high-power, high-end electronic devices, ensuring optimal performance, reliability, and longevity.
Features


Exceptional Thermal Conductivity: With a thermal conductivity of 7.0 W/m·K, this pad offers outstanding heat transfer capabilities, ensuring critical components remain within safe operating temperatures.

Superior Electrical Insulation: The silicone material provides excellent dielectric strength, protecting sensitive electronic components from electrical shorts.

Highly Flexible and Conformable: Soft and pliable, the pad easily conforms to the surface irregularities of electronic components, improving thermal contact and heat transfer efficiency.

Durable and Reliable: Resistant to environmental factors such as moisture, temperature fluctuations, and mechanical stress, ensuring long-lasting performance and reliability.


Application
High-Performance Servers and Data Centers: Critical for cooling processors, memory modules, and power supplies in high-performance servers and data center equipment.
Advanced Gaming Consoles: Ideal for managing the significant heat generated by powerful CPUs and GPUs in next-generation gaming consoles.
Telecommunications Infrastructure: Perfect for base stations, network switches, and other high-power telecom equipment requiring reliable thermal management.
Electric Vehicles (EVs): Essential for efficient heat dissipation in battery packs, power inverters, and electronic control units (ECUs) in electric vehicles.
Medical Imaging Equipment: Crucial for thermal management in high-power medical imaging devices, ensuring stable and accurate performance.
Industrial Automation Systems: Suitable for cooling high-power industrial control systems, motor drives, and other automation equipment.
Renewable Energy Systems: Applied in solar inverters, wind turbine electronics, and other renewable energy systems where efficient thermal management is vital for performance and longevity.
Specification
Testing Item Testing Value Testing Method
Thickness(MM) 0.75-10MM or Customized ASTM D374
Components Silicone Rubber &Ceramics --
Colour Grey or Customized Visual
Hardness (Shore C) 30-50 ASTM D2240
Density(G/M3) 3.3±0.1 ASTM D792
Tensile Strength(KN/M) 0.1 ASTM D412
Extensibility(%) 30 ASTM D374
Working Temperature(℃) -40~200 EN344
Breakdown Voltage(KV) >4 ASTM D149
Volume Resistivity(Ω·CM) 1.5×1011 ASTM D257
Dielectric Constant(@1MHz) 8 ASTM D150
Weight Loss ratio (%) 1 @200℃240H
Standard Size(W*L:MM) 200*400 -
Flaming Rating V-0 UL-94
Thermal Conductivity(W/M.K) 7.0 ASTM D5470
1:The data of conductive interface sheet is just for reference.
2:Different thermal conductive pad has different application areas,
3.Any application solution question,welcome to check with our team.
4 Sheet size&shape can be cut as customized.
5.Adhesive and reinforce fiberglass can be added as requested.
SpecificationsBrochure
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7.0W/M.K Silicone Thermal Pad Email:info@nfion.com