NF150-150 Silicone Thermal Pad: The Trusted Choice for Efficient Heat Dissipation-NFION

NFION NF150-150 Silicone Thermal Conductive Pad — The Ideal Choice for Efficient Thermal Management

Author：NFION Date：2025-10-24 14:24:50

Introduction: Understanding Reliability from the Perspective of Heat

As electronic products evolve toward higher performance, miniaturization, and greater power density, thermal management has become a key factor affecting device performance and lifespan. Whether in new energy vehicle control systems, communication base stations, power modules, or consumer electronics, excessive operating temperature can cause system degradation or even failure.

Against this background, the NFION NF150-150 silicone thermal conductive pad was developed. With its high thermal conductivity, flexibility, and excellent electrical insulation, it provides engineers with an efficient, stable, and customizable thermal management solution that ensures outstanding performance even under harsh conditions.

Product Overview: A Perfect Balance of Thermal Conductivity and Structural Adaptability

NF150-150 is a flexible thermal interface material (TIM) made from polymer-based silicone combined with high-conductivity fillers. With a thermal conductivity of 1.5 W/m·K, it achieves efficient heat transfer while maintaining softness, ensuring intimate surface contact under low assembly pressure and significantly reducing interface thermal resistance.

Whether used between power chips, heat sinks, modules, or enclosures, NF150-150 effectively transfers heat, helps maintain temperature balance, and enhances system reliability and service life.

Key Advantages: More Efficient, Safer, and More Stable Heat Transfer

1. High Thermal Conductivity and Rapid Heat Dissipation

With a thermal conductivity of 1.5 W/m·K, NF150-150 meets the thermal design needs of medium-power devices, reducing thermal resistance between the chip and heat sink to improve overall cooling efficiency.

2. Excellent Flexibility and Compressibility

With adjustable hardness down to Shore C 20 and a compressibility of up to 30%, it conforms perfectly to surfaces, fills microscopic gaps, minimizes interface stress, and maximizes contact area.

3. Outstanding Electrical Insulation

With a breakdown voltage of ≥6KV, NF150-150 remains electrically safe and stable under high-voltage or high-power conditions, ensuring long-term operational safety.

4. Wide Temperature Stability and Long-Term Reliability

Operates reliably from -40℃ to 150℃ without hardening, cracking, or degradation during thermal cycling or prolonged use.

5. Environmentally Friendly and Compliant

Certified by RoHS and REACH, with no silicone oil migration—safe for optical and precision electronics, ensuring a cleaner and safer application.

Test Item	Parameter	Unit	Test Standard
Thermal Conductivity	1.5(±0.2)	W/m⋅K	ASTM D5470
Thermal Resistance	≤1.5	∘C in²/W	ASTM D5470
Color	Gray, Blue, Pink	-	Visual
Thickness	0.3−15	mm	ASTM D374
Hardness	35±5	Shore C	ASTM D2240
Density	2.6(±0.5)	g/cc	ASTM D 792
Flammability Rating	V0	-	UL 94
Operating Temperature	−50∼160	℃	IEC 60068-2-14
Dielectric Breakdown Voltage	≥6	Kv	ASTM D 149
Volume Resistivity	≥10⁸	Ω⋅cm	ASTM D 257

Typical Applications: The Core Thermal Management Material Across Industries

NF150-150 is widely applied in multiple sectors thanks to its superior thermal, mechanical, and electrical properties:

Application Industry	Typical Applications
New Energy	1. Power Battery Packs/Modules: Thermal conduction between battery cells and liquid cooling plates or heat dissipation structural components
	2. Photovoltaic Inverter (PV Inverter): Thermal conduction between power modules (such as IGBT or MOSFET) and heat sinks
	3. Energy Storage System PCS/BMS: Thermal conduction between power devices in energy storage converters and heat sinks
	4. Electric Vehicle On-Board Charger (OBC): Heat dissipation for internal high-power components (such as inductors, switches)
	5. Wind Power Converter: Heat dissipation for high-power semiconductor devices in inverters and heat sinks
Automotive Electronics	1. ADAS/Autonomous Driving Domain Controller: Thermal conduction between high-performance computing chips (CPU/GPU) and the enclosure/heat sink
	2. In-Vehicle Infotainment System (IVI): Heat dissipation for main control chips or backlight modules
	3. High-Power DC-DC Converter: Thermal conduction between power components (such as MOSFETs, transformers) and the enclosure
	4. LED Car Headlight Module: Thermal conduction between the LED light source and the heat dissipation substrate/lamp body
	5. Vehicle Radar/LiDAR Module: Heat dissipation for internal microwave or laser emitting components and the enclosure
Network Communication	1. 5G/6G Communication Base Station: Thermal conduction between RF Power Amplifier (PA) modules and heat sinks
	2. Optical Module/Fiber Optic Transceiver: Heat dissipation for internal lasers or high-speed chips and the enclosure
	3. Servers/Switches: Thermal conduction between CPU/GPU, high-power memory or solid-state drives and heat sinks
	4. Data Center Power Module: Heat dissipation for power devices (IGBT/MOSFET) and heat sinks
	5. Routers/Gateway Devices: Heat dissipation for main control chips or wireless RF chips and heat sinks
Industrial Power	1. Industrial PC/PLC Power Supply: Thermal conduction between internal transformers, rectifier bridges or switching tubes and heat sinks
	2. High-Power UPS Uninterruptible Power Supply: Heat dissipation for IGBT modules and power devices in battery management units
	3. Electric Vehicle Charging Pile: Thermal conduction between power devices (such as IGBT, inductors) in the charging module and heat sinks
	4. Rail Transit Power Supply: Heat dissipation for high-power electronic components such as traction inverters
	5. Industrial Laser Power Supply: Heat dissipation for power components in laser drive modules
Consumer Electronics	1. Smartphones/Tablets: Thermal conduction between the main chip (SoC), memory module or battery and the mid-frame/graphene film
	2. Laptops/Gaming Laptops: Thermal conduction between CPU/GPU chips and heat pipes/vapor chambers
	3. OLED/LCD Display Backlight Module: Heat dissipation for drive ICs or light source components
	4. TWS Headphone Charging Case: Heat dissipation for wireless charging receiving coils or main control chips
	5. High-Performance Solid State Drives (SSD): Thermal conduction between controller chips or flash memory particles and heat sinks
LED Lighting	1. High-Power LED Street Lights: Thermal conduction between COB/high-power LED light sources and heat sinks
	2. LED Floodlights/High Bay Lights: Thermal conduction between LED modules and heat dissipation enclosures
	3. LED Display Modules: Heat dissipation for drive ICs or power modules and PCB boards/enclosures
	4. LED Photography Lights/Studio Lights: Heat dissipation for high-brightness LED chips and heat dissipation modules
	5. Automotive LED Headlights: Thermal conduction between LED chips and lamp body heat sinks
Artificial Intelligence	1. AI Servers/Accelerator Cards: Thermal conduction between high-performance AI chips (ASIC/GPU/FPGA) and liquid/air coolers
	2. Edge Computing Devices/Industrial PCs: Heat dissipation for edge AI chips (such as NPU) and enclosures/heat sinks
	3. AI Smart Robots: Heat dissipation for heating elements in main control boards and motor drive modules
	4. Drone Flight Control System: Thermal conduction between the main control chip, power management unit, and the enclosure
	5. VR/AR Head-Mounted Devices: Heat dissipation for internal main control chips, display driver chips and heat sinks

NF150-150 has become the preferred choice for engineers designing thermal management solutions across diverse applications due to its high compatibility and customization options.

Design & Application Recommendations: Precision Optimization for Engineers

Engineers can select NF150-150 of different thicknesses based on thermal load and structural design needs. The standard thickness range of 0.3–15 mm accommodates applications from precision electronics to high-power modules.

NFION also provides customized die-cutting, adhesive backing, and stamping services to enable rapid assembly and dimensional consistency. Its flexible nature absorbs thermal stress caused by expansion and contraction, extending component lifespan and enhancing system reliability.

NFION Advantages: Professional Expertise for Premium Thermal Management

As a National High-Tech Enterprise and Shenzhen Specialized and Innovative Enterprise, NFION has been deeply engaged in the thermal interface materials field for over a decade, offering independent R&D, precision manufacturing, and rapid delivery capabilities.

Certified under ISO9001, IATF16949, QC080000, and recognized by UL, RoHS, and REACH, NFION products serve renowned brands including BYD, Xiaomi, Huawei, Jiuzhou, and Shuangyi.

The design of NF150-150 reflects NFION’s brand philosophy — "Defining reliability through performance, and achieving professionalism through precision."

Conclusion: NF150-150 — Smarter and More Efficient Thermal Management

Material selection defines the performance ceiling of thermal design. With excellent conductivity, flexibility, and insulation, NF150-150 offers the perfect balance of efficiency and reliability.

NFION will continue to deliver high-quality, stable thermal management solutions, empowering industries to achieve higher performance, greater safety, and long-lasting durability.

Tag： silicone thermal conductive pad thermal management solution electrical insulation performance flexible thermal interface material

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