Ultra-High Thermal Conductivity: 5.0W/m·K for powerful heat dissipation in dense electronic systems
Superior EMI Absorption: Attenuates GHz-level electromagnetic waves, enhances EMC
Highly Compressible & Flexible: Perfect for filling gaps and reducing mechanical stress
Easy to Apply: Naturally tacky surface; supports die-cutting, no extra adhesive needed
RoHS & UL94 V-0 Compliant: Environmentally safe and flame retardant
Customizable Thickness & Shape: Tailored to specific design and thermal demands