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The application of thermally conductive silicone pads in heat sinks is primarily based on their outstanding thermal conductivity and material properties. In electronic devices, there are often small irregularities or gaps between heat-generating components (such as CPU, GPU, power module, etc.) and heat sink, making it difficult to achieve good contact for effective heat transfer when connected directly. The primary function of a heat sink is to rapidly dissipate the heat generated inside the device to prevent damage or performance degradation due to overheating. Thermally conductive silicone pads, as an efficient heat transfer medium, can establish an effective heat transfer path between the heat sink and the heat source.
Secondly, thermally conductive silicone pads possess excellent material properties. They have good elasticity and compression resistance, allowing for a tight contact interface to be formed between the heat sink and the heat source. This close contact reduces thermal resistance during heat transfer, further enhancing the cooling effect. Additionally, thermally conductive silicone pads have good insulating properties, effectively preventing electrical short circuits within the device.
