1.0W/m.k Silicone Thermal Putty

Material：Silicone
Thermal Conductivity：1.0W/m.k
Temperature Tange:-40~200℃
Breakdown Voltage：≥5KV/MM
Certification: ROHS,REACH

Introduction

1.0W/M.K Silicone Thermal Putty is engineered to provide exceptional thermal conductivity and efficient heat transfer for high-performance electronics. Designed to fill gaps and irregular surfaces, this putty ensures optimal thermal management, significantly reducing the risk of overheating. It is an ideal solution for users seeking reliable and long-lasting thermal interface materials that enhance the performance and longevity of their devices.

Features

● Single-Component: Simplifies the application process with no mixing required.

● Non-Curing: Remains pliable and can be reapplied or adjusted as needed.

● Automated Dispensing: Compatible with automated dispensing systems, ensuring precise application and efficiency.

● High Thermal Conductivity: With a thermal conductivity of 1.0 W/M.K, it ensures excellent heat dissipation.

● Excellent Gap Filling: Fills gaps and voids effectively, providing uniform thermal contact.

● Wide Operating Temperature Range: Maintains performance across a broad temperature range, ensuring reliability in various conditions.

Application method

The Silicone Thermal Putty can be applied using automated dispensing equipment for precise and efficient application. It is ideal for situations where consistent and repeatable application is crucial. The putty can also be manually applied for smaller-scale operations or detailed work.

Application

Specification