0.1mm Thermal Conductive Adhesive Tape
0.1mm Thermal Conductive Adhesive Tape

0.1mm Thermal Conductive Adhesive Tape

0.1mm Thermal Conductive Adhesive Tape
Adhesive:Acrylic
Thickness:0.1MM
Material:Glass fiber
Thermal Conductivity:1.2W/m.k
Adhesive Type:Pressure Sensitive
Temperature Resistance:-20-120℃
Breakdown Voltage:≥2Kv/mm
Adhesive:Acrylic
Thickness:0.1MM
Material:Glass fiber
Thermal Conductivity:1.2W/m.k
Adhesive Type:Pressure Sensitive
Temperature Resistance:-20-120℃
Breakdown Voltage:≥2Kv/mm
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Introduction
Thermal conductive double-sided tape is a common adhesive material, which is composed of acrylic polymer mixed with thermal conductive ceramic powder, coated on both sides of glass fiber cloth, and compounded with adhesive. The tape substrate is the main load-bearing structure of thermal conductive double-sided tape, which can provide strength and stability. Thermal conductive fiberglass material is a key component of thermal conductive double-sided tape, which has good thermal conductivity and can effectively transfer heat. Double sided adhesive plays a bonding role, fixing the thermal conductive interface material onto the tape substrate. Through this combination, thermal conductive double-sided tape can effectively conduct heat while bonding, improving thermal performance and stability.
Features
High thermal conductivity: Effectively transfers heat from heat-generating components (such as LEDs, processors, etc.) to heat sinks or other cooling structures, assisting in maintaining an appropriate operating temperature for electronic devices.

Insulation: Despite its excellent thermal conductivity, thermal conductive double-sided tape also retains its insulating properties, ensuring electrical safety and suitability for bonding electronic components.

Flexibility and compressibility: Adapts to uneven surfaces, fitting closely between heat sources and heat sinks, maintaining good contact even with slight deformations.

Conformability and high adhesion: Once pressed into place, it adheres firmly to material surfaces, streamlining the assembly process and eliminating the need for additional mechanical fasteners like screws or clamps.

Broad temperature adaptability: Maintains stable performance over a wide temperature range, resistant to both high and low temperatures.
Application
Electronics and Electrical Industry: It is widely applied in the thermal design of products such as mobile phones, computers, tablets, and power supplies. It tightly binds heat-generating components like processors, chips, and LED emitters to heat sinks, effectively enhancing thermal conductivity efficiency and ensuring long-term stable operation of devices.
LED Lighting: Particularly in high-power LED luminaires, thermal conductive double-sided tape becomes a pivotal material in addressing heat dissipation challenges. It can be directly adhered between the LED aluminum substrate and the heat sink, simplifying the assembly process, enhancing the heat dissipation efficiency of the lamps, and prolonging their lifespan.
Hardware Industry: In hardware products that require heat management, such as switch power supplies and control panels, thermal conductive double-sided tape offers a convenient thermal transmission solution.
Printed Circuit Board (PCB) Manufacturing: Used for bonding high-power components on PCBs with heat dissipation structures, it replaces traditional thermal grease or silicone pads, streamlining the manufacturing process and reducing costs.
Specification
Testing Item Unit Testing Value Testing Method
Substrate - Glass Fabric -
Colour - White Visual
Thickness MM 0.1 -
Peel Strength under 180° (PSTC-101)(N/25MM) 13 PSTC-1
Retention 1KG/INCH/25°C 48 PSTC-1
Adhesion KG/IN 1.1 PSTC-1
Initial Viscosity KG/IN 0.6 PSTC-1
Breakdown Voltage KV/MM 2 ASTMD149
Long-term Highest Temperature resistance °C 80 EN344
Short-term Highest Temperature °C 120 EN344
Working Temperature °C -20°C120°C EN344
Conductivity W/M.K ≥1.2 ASTM D5470
SpecificationsBrochure
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